A new technical paper titled “Omni 3D: BEOL-Compatible 3-D Logic With Omnipresent Power, Signal, and Clock” was published by researchers at Stanford University, Intel Corporation and Carnegie Mellon ...
A new technical paper titled “On the Thermal Vulnerability of 3D-Stacked High-Bandwidth Memory Architectures” was published by researchers at North Carolina A&T State University and New Mexico State ...
A new power supply technology for 3D-integrated chips has been developed using a vertically stacked architecture, where processing units are positioned directly above dynamic random access memory ...
AMD had a surprise at Computex: CPUs with a lot of L3 cache, and a claimed generational-equivalent performance uplift. Share on Facebook (opens in a new window) Share on X (opens in a new window) ...
Intel's Innovation 2023 event is underway in San Jose. The headline is the launch of the exciting Meteor Lake architecture. As a laptop oriented architecture, Meteor Lake chips aren't necessarily ...
AMD made quite the splash during its keynote at Computex 2021. In addition to launching a new Radeon RX 6000M mobile series based on its RDNA 2 graphics architecture, the biggest surprise came in ...