Semiconductor Engineering

Characterization Of Micro-Bumps For 3DIC Wafer Acceptance Tests

Custom DC positioners with theta-X planarizing capability and true Kelvin probes have allowed for successful demonstration of consistent and repeatable test results in fully automatic micro-bump wafer ...
EDN

ASE plans to solder bump 5,000 300mm wafers a month

ASE Inc. is launching solder bumping technology for 300mm wafers. The Santa Clara, Calif., supplier of semiconductor packaging and testing services will bump, sort, saw, and die attach the wafers ...
Business Wire

Hprobe Announces New Generation of Magnetic Test Head for Wafer Sort of MRAM in Mass Production

GRENOBLE, France--(BUSINESS WIRE)--Hprobe, a provider of turnkey semiconductor Automatic Test Equipment (ATE) for magnetic devices, today announced a breakthrough magnetic test head revolutionizing ...
EDN

UTAC opens Southeast Asia’s first 300-mm wafer sorting plant

SINGAPORE–Singapore's United Test and Assembly Center Ltd. (UTAC) here today announced the grand opening of what the company claims is Southeast Asia's first 300-mm wafer sorting facility. UTAC, a ...
Semiconductor Engineering

Debug And Traceability Of MCMs And Chiplets In The Manufacturing Test Process

Single die packages and products have been the norm for decades. Moreover, so has multi-chip modules (MCMs) or system in package (SiP) for quite some time. Understandably, with ASICs and SoCs becoming ...