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Nvidia's Blackwell lineup suggests less demand for TSMC's CoWoS-S: Kuo
The 200 series, which includes the GB200 NVL72 and HGX B200, features a dual-die design and is manufactured using CoWoS-L. The 300 series, which includes the GB300 NVL72 and HGX B300 NVL16, use ...
Benzinga.com10d
Ming-Chi Kuo Dismisses Nvidia Order Cut Speculation Amid Intact AI Demand, Confirms TSMC Expansion On Track
Despite market speculation of a major reduction in Nvidia Corporation's NVDA 2025 Chip-On-Wafer-On-Substrate (CoWoS) wafer orders at Taiwan Semiconductor Manufacturing Co TSM, renowned analyst ...
Design-Reuse3y
GUC Tapes Out AI/HPC/Networking Platform on TSMC CoWoS Technology Validating 7.2 Gbps HBM3 Controller and PHY, GLink-2.5D and 112G-LR SerDes IPs
Hsinchu, Taiwan – June 8, 2021 – Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that it has successfully taped out AI/HPC/Networking CoWoS® Platform with 7.2 Gbps HBM3 ...
Design-Reuse2y
GUC Demonstrate World's First HBM3 PHY, Controller, and CoWoS Platform at 7.2 Gbps
The platform supports both the TSMC CoWoS-S (silicon Interposer) and the CoWoS-R (organic interposer) advanced packaging technologies. The platform represents real-world CPU/GPU/AI/Networking chips by ...