The 200 series, which includes the GB200 NVL72 and HGX B200, features a dual-die design and is manufactured using CoWoS-L. The 300 series, which includes the GB300 NVL72 and HGX B300 NVL16, use ...
Despite market speculation of a major reduction in Nvidia Corporation's NVDA 2025 Chip-On-Wafer-On-Substrate (CoWoS) wafer orders at Taiwan Semiconductor Manufacturing Co TSM, renowned analyst ...
TSMC management has confirmed plans to double advanced chip-packaging capacity, called CoWoS, by the end of 2024. CoWoS is needed to make Nvidia’s highest-performing AI chips. Among other chip ...
Hsinchu, Taiwan – June 8, 2021 – Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that it has successfully taped out AI/HPC/Networking CoWoS® Platform with 7.2 Gbps HBM3 ...
Supply chain sources indicate that TSMC's CoWoS capacity target for 2025 has been slightly adjusted downward, however, it is expected to rise consistently with the addition of new capacity in the ...
More than 70% of TSMC’s CoWoS-L advanced packaging capacity has already been booked, fueled by strong demand for Nvidia’s Blackwell GPUs. This surge is also driving orders to major backend ...
The platform supports both the TSMC CoWoS-S (silicon Interposer) and the CoWoS-R (organic interposer) advanced packaging technologies. The platform represents real-world CPU/GPU/AI/Networking chips by ...
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