The performance of semiconductors has primarily been achieved through the miniaturization of devices. As devices are miniaturized to the scale of a few nanometers, economic and physical limits are ...

Liquid-phase bonding relies on the formation of a transient liquid film at the interface which reduces the requirement for accurate fit-up and also accelerates the diffusion process. With solid state ...

Cold bonding between dissimilar metals and alloys offers several benefits, such as the absence of soft heat-affected zones and thick intermetallic layers with properties that differ from those of the ...