EDN

Package shrinks switch footprint

Beverly, Mass. – Clare Inc.'s line card access switch family is now available in micro lead frame packages (MLPs). The monolithic-IC replacements for 2 Form C electromechanical relays were previously ...
Electronic Design

Leadless MOSFET Power Package Achieves Near-GaN Switching Losses

Modern semiconductors facilitate faster switching speeds and lower losses to support designers. A new leadless power package drives down on-state resistance and provides close to “GaN-like” switching ...
Electronic Design

Four-Pin TO Type MOSFET Package Lowers Switching Losses

For many recent generation power semiconductors, package innovation makes a significant contribution to key performance parameters. In the case of HV MOSFETs, high-speed hard-switching transitions are ...
Nasdaq

Alpha and Omega Semiconductor Releases Fast Switching 600V αMOS5™ Super Junction MOSFETs in SMD-type TOLL Package

Optimized for High-Density, High-Power Server Power Supplies, and PV Inverters Fast Switching 600V αMOS5™ Super Junction MOSFETs in SMD-type TOLL Package (Graphic: Business Wire) The new αMOS5 TOLL ...
Financial Post

Toshiba Releases 3rd Generation SiC MOSFETs for Industrial Equipment with Four-Pin Package that Reduces Switching Loss

The new products are the first in Toshiba’s SiC MOSFET line-up to use the four-pin TO-247-4L(X) package, which allows Kelvin connection of the signal source terminal for the gate drive. The package ...