Researchers from Pohang University of Science and Technology (POSTECH) and the University of Montpellier have successfully synthesized wafer-scale hexagonal boron nitride (hBN) exhibiting an ...

LONDON — Researchers at the University of Southampton have developed a technique that will allow silicon wafers to be stacked accurately and inexpensively in 3-D structures. The approach adopted by ...

Researchers at the University of Illinois Urbana-Champaign have demonstrated a method for stacking silicon transistors in ...

IBM and one of its partners have figured out how to bond two silicon wafers together without requiring a glass carrier, theoretically simplifying the entire process. Share on Facebook (opens in a new ...

Bernin (France), June 3, 2025 – Soitec (Euronext – Tech Leaders), a world leader in the design and production of innovative semiconductor materials, today announced a strategic collaboration with ...

Researchers may have unlocked the future of computing by turning flat silicon chips into densely stacked 3D architectures.

Tokyo Institute of Technology (Tokyo Tech) WOW Alliance and the National Cheng Kung University (hereinafter, NCKU) agree on a technical partnership to promote the social implementation (practical ...

Two-dimensional (2D) van der Waals (vdW) heterostructures are considered to be one of the best routes for exploring 2D physics and device applications 5,14,16,25,26,27. Multiple-layered vdW ...

Say you wanted to create a chip in which a processor fabricated in 32-nm process rules would be combined with memory done on a 65-nm process and analog blocks fabricated at 180 nm. This leads you to ...

For decades, chipmakers squeezed more transistors onto processors by shrinking them sideways. That playbook is running out of room. Now, a team of engineers has demonstrated a different strategy: ...