IGMTLSV03A is a synchronous ULVT periphery high-density ternary content addressable memory (TCAM). It is developed with TSMC 16nm 0.8V/1.8V CMOS LOGIC FinFET Compact process. Different combinations ..

The Ultra PLL is designed with a state-of-the-art architecture using high-speed digital and analog circuits that offers exceptional performance, features and ease of use. It is highly programmable so ...

The U.S. government plans to unveil stricter regulations to block shipments of advanced processors made by TSMC, GlobalFoundries ... processors made on 14nm or 16nm process technologies or ...

The chiplet slots are configured to allow various combinations of processor chiplets (16nm Tensilica LX7 by TSMC) and memory chiplets (4nm Intel) to be assembled depending on the intended application.