Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced the successful launch of the industry's first Universal ...

They explored the possibility of TSMC’s investing in the U.S. chipmaker, Intel, in a deal that would see it take over the ...

Co-WoS-S has a high production cost and uses a single silicon interposer, which sometimes faces yield issues. The CoWoS-L is newer tech produced by TSMC. It incorporates active components in the ...

A major breakthrough at Peking University might have just found the first step beyond silicon for semiconductors.

Samsung Electronics has reportedly begun developing a next-generation packaging material, the "glass interposer," a move aimed at replacing the costly silicon interposers currently used in ...

Taiwan is under constant threat of Chinese invasion—something that could become more likely now that America has its own ...

The rumor that the U.S. government is allegedly pushing a joint venture between Intel and TSMC has sparked an outcry in Taiwan about the chance of the country losing its 'Silicon Shield,' a theory ...

For Taiwan, TSMC’s dominance of advanced chip manufacturing has become what some commentators call a “silicon shield” that deters military action by China and encourages support from the ...

ATLANTA--(BUSINESS WIRE)--Silicon Creations, a leading provider of high-performance analog and mixed-signal intellectual property (IP), today announced the successful tape-out of a TSMC N2P chip ...