Semiconductor Engineering

Microarchitecture Tailored to 3D-Stacked Near-Memory Processing LLM Decoding (U. of Edinburgh, Peking U., Cambridge et al.)

A new technical paper, “Rethinking Compute Substrates for 3D-Stacked Near-Memory LLM Decoding: Microarchitecture-Scheduling ...
Semiconductor Engineering

HW-SW Co-Designed System With 3 Core Optimization Pathways For Long-Context Agentic LLM Inference (Cambridge, ICL)

A new technical paper titled “Combating the Memory Walls: Optimization Pathways for Long-Context Agentic LLM Inference” was published by researchers at University of Cambridge, Imperial College London ...