Season 6 of DigiKey's Factory Tomorrow series highlights how manufacturers and suppliers are building the foundation for next ...

Renesas' 650V GaN device uses an 8x8mm dual-side-cooled package to increase power density in high-voltage data-center ...

GNSS advances, correction services and wireless technologies are enabling scalable, high-precision positioning for live ...

Taiwan and Singapore AI associations establish cooperation framework linking businesses, technical expertise, talent ...

Global cellular IoT module shipments grew 11% YoY in 2Q 2026, with China and India accounting for the three-fourth of ...

SG Semiconductor links R&D and manufacturing in Singapore's chip ecosystem. Global competition in semiconductors is ...

Startup combines AI-based design and verification with internal tools to accelerate complex ASIC development from concept to ...

Microchip's latest devices support next-gen zonal architectures, delivering flexible, space-efficient connectivity that ...

Siemens and TSMC expand AI-enabled EDA workflows, packaging support and certification across leading process technologies.

M31 and Ambiq combine low-leakage SRAM and standard-cell IP for power- and area-constrained AIoT and edge SoCs.

Growing AI chip sizes are pushing advanced packaging beyond reticle limits, increasing adoption of CoWoS-L and competing EMIB ...

Cadence and TSMC have expanded certified AI and HPC design flows across advanced nodes, chiplets and 3D-ICs.