Co-packaged optics require hybrid testing systems with reliable alignment techniques that can handle both electrical and optical signals simultaneously.

Another billion-dollar company is receiving millions of dollars in taxpayer funds to expand operations in Texas, this time ...

Silicon wafers can be used in producing chips and ... Foundries are increasingly investing in new advanced packaging techniques, especially silicon substrate-based. Foundry vendors are researching ...

ASE has introduced a Silicon Photonics packaging platform designed to deliver innovative ... In the long run, we believe the ideal packaging solution will involve utilizing a full-scale wafer as a ...

OpenLight, the world leader in custom PASIC chip design and manufacturing, and Tower Semiconductor (NASDAQ/TASE: TSEM), the ...

Malaysia’s semiconductor sector sees a boost with ARM’s US$250M investment, aiming for high-value chip design and advanced ...

Researchers have demonstrated an integrated optical link on a silicon wafer that exhibits high-speed data transmission with very low power consumption.

TASMIT Inc. has released a new inspection system for glass substrates as part of its INSPECTRA series of semiconductor wafer visual inspection systems, which has received attention for its high ...

Innovation paves the way for a high-volume, silicon photonics 400G/lane platform ... and the ability to use flip chip processes when packaging into an integrated optical sub-assembly." ...

Currently, in 2.5D packaging, a next-generation semiconductor manufacturing ... Traditionally, silicon interposers made from 12-inch silicon wafers have been used, but since wafers are circular, the ...

Micron has AI-driven data center growth, HBM3E ramp-up, and stabilizing memory prices. Click here to read why MU stock is a ...

Infineon Technologies has partnered with CDIL Semiconductors to tap into emerging business cases including light EVs and ...