The Marvell® 2nm platform will enable hyperscalers to dramatically boost the performance and efficiency of their infrastructure to meet the performance and efficiency demands of the AI era. Built on ...

Built on TSMC's 2nm process, the silicon is a critical ... The silicon IP includes high-speed 3D I/O for vertically stacking die inside chiplets. Given a projected 45% TAM growth annually, custom ...

The Nvidia GeForce RTX 5070 offers very little over the RTX 4070 Super or competing cards other than Multi Frame Generation.

Starting in the die and processing core, RDNA 4 moves away from the MCM design of two different chips, one for graphics and the other for IO, instead of moving back to monolithic while keeping the ...

The talks come after the Trump administration requested TSMC to assist in turning around the troubled technology company.

IGAD2DY01A is a high speed die-to-die interface PHY which transmits data through TSMC advanced packaging solutions：Integrated Fan-Out (InFO) with RDL interconnect and Chip-on-Wafer-on-Substrate ...

Taiwanese chipmaker TSMC is expanding investment in the United States because of large U.S. customer demand, its CEO said on ...

The Taiwanese chip contract manufacturer TSMC is said to have proposed a joint venture to four US companies to take over Intel's ailing chip manufacturing division (Intel Foundry): Nvidia ...

A Reddit user claims to have discovered an entire 12nm TSMC wafer discarded in a dumpster ... After dicing, each die is tested and sorted based on factors like speed, power efficiency, and defect ...

To date, TSMC has only built semiconductor plants for the production of chips, but not for further processing. For simple processors, only one die is placed on a carrier. For more complex designs ...