Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced the successful launch of the industry's first Universal ...

This milestone was achieved using TSMC’s advanced N3P process and CoWoS® packaging ... several dies with North-South and East-West IP orientations are interconnected through CoWoS interposer. The ...

By way of example, TSMC's N3E node as used in the latest Apple chips has gate pitch of at minimum 45 nm and a metal pitch of ...

A major breakthrough at Peking University might have just found the first step beyond silicon for semiconductors.

Integrating the functionality of the HBM base die into a logic die provides greater flexibility and additional control.

SINGAPORE/NEW YORK/TAIPEI, March 12 (Reuters) - TSMC (2330.TW), opens new tab has pitched U.S. chip designers Nvidia (NVDA.O), opens new tab, Advanced Micro Devices (AMD.O), opens new tab and ...

In the on-again, off-again saga of TSMC's supposed designs on Intel's chip factories, there's a new twist. Reuters reports that TSMC has pitched Nvidia, AMD and Broadcom with the idea of a joint ...

The island democracy’s former President Ma Ying-jeou wasted no time in accusing the ruling Democratic Progressive Party (DPP) of “selling TSMC ... serves as a “silicon shield,” a ...

The claimed upshot includes the aforementioned 1.4x operating speeds at 90% power consumption versus cutting edge commercial silicon nodes. Given that Intel and TSMC nodes are hardly identical ...

As the manufacturer of most of the AI chips in the world, TSMC’s sales are a barometer for the sector. Wall Street and Silicon Valley are now debating the sustainability of an AI frenzy that made ...