Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced the successful launch of the industry's first Universal ...

This milestone was achieved using TSMC’s advanced N3P process and CoWoS® packaging ... several dies with North-South and East-West IP orientations are interconnected through CoWoS interposer. The ...

At maximum data rate, this provides a total interface bandwidth of 1075.2 GB/s.The PHY is designed for a 2.5D system with a silicon interposer to route signalsbetween the 3D DRAM stack and PHY.

For instance, TSMC's chip-on-wafer-on-substrate technology developed the world's largest silicon interposer that features room for two massive processors combined with 8 HBM memory devices in a ...

To implement a UCIe die-to-die link, designers must address several critical multi-die health challenges, including: ...

The silicon interposer that connects the dies of the two chips bridges ... Because of the similarities in core counts between ...

These technologies support side-by-side placement of chips and chiplets using a silicon bridge or interposer (2.5D ... Pure-play foundries, particularly TSMC, have taken a commanding lead in this ...

TSMC Partnership: The collaboration with TSMC ... which is RDL organic RDL rather than silicon interposer products. So that’s a first ramp of that device, which is really exciting for us.