Co-WoS-S has a high production cost and uses a single silicon interposer, which sometimes faces yield issues. The CoWoS-L is ...

Nvidia CEO Jensen Huang officially announced the Spectrum-X and Quantum-X silicon photonic (SiPh) network switches, enabling ...

I personally see more push towards organic substrates. Chip-on-Wafer-on-Substrate (CoWoS) from TSMC uses a silicon interposer and has been the technology of choice for about 12 years. More recently ...

Korean memory giant SK hynix will extend its partnership with Taiwan's TSMC to collaborate on the ... multiple dice horizontally on a silicon interposer in order to achieve better density and ...

Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced the successful launch of the industry's first Universal ...

The rumor that the U.S. government is allegedly pushing a joint venture between Intel and TSMC has sparked an outcry in Taiwan about the chance of the country losing its 'Silicon Shield,' a theory ...

ATLANTA--(BUSINESS WIRE)--Silicon Creations, a leading provider of high-performance analog and mixed-signal intellectual property (IP), today announced the successful tape-out of a TSMC N2P chip ...