Apple supply chain analyst Ming-Chi Kuo today reiterated that the A20 chip in iPhone 18 models will be manufactured with TSMC's 2nm process.

Apple's M3 chips successfully brought all-new performance levels but quickly became problematic, leading to the shortest lifespan of any microchip in Apple history.

Discover why ASML dominates the lithography market with 90% DUV share, strong R&D, and robust growth prospects amid ...

The Global Semiconductor Wafer market is projected to grow significantly, from 24,362.2 million in 2025 to 42,987.0 million ...

Extreme ultraviolet (EUV) lithography is at the center of next-generation semiconductor manufacturing as it enables smaller ...

TSMC is in JV talks with Intel to enhance its foundry division, but due to antitrust concerns, a full foundry JV is unlikely ...

From thinning and trimming to bonding and debonding, 3D package quality is built on precise and extremely thin wafer ...

Intel Corporation, Microsoft Corporation, Alphabet Inc Class A, Qualcomm Incorporated. Read 's Market Analysis on Investing.com ...

Apple might stick to using TSMC's third-generation process node (N3P) for the A20 chips powering the iPhone 18 in 2026.

Intel’s new CEO, Lip-Bu Tan,has proposed major changes to the company’s chip manufacturing processes and artificial ...

Why IBM, TSMC, Quantinuum, and SambaNova Systems are among Fast Company’s Most Innovative Companies in computing for 2025.

San Francisco: Intel's incoming CEO Lip-Bu Tan has considered significant changes to its chip manufacturing methods and ...