The laser module is one of the least reliable components in such a system. For that reason, it remains in a convenient ...
Every time a transistor switches, it generates heat. Pack enough transistors together and you hit a wall: the chip melts ...
Five interconnected areas critical to strengthening U.S. leadership.
Because permeation and plasma-induced degradation are continuous rather than episodic, their effects accumulate gradually. There may be no excursion event, no sudden leak, and no particle spike to ...
However, sTIMs cannot be used alone, they require backside metallization (BSM) on the module to establish a thermal path and adhesion between the lid, sTIM, and the module. Conventional BSM processing ...
2026 will be a transformative year in this area — one where force fields redefine the boundaries of atomistic simulation, making previously unthinkable modeling and discoveries routine. With workflows ...
The significant increase in computing requirements for computational lithography and how GPUs can meet this demand while facilitating faster deployment times.
The variety of compositions available gives designers many options to achieve the specific properties they need. Indium tin oxide (ITO), In 2 O 3, indium gallium oxide (IGO), indium gallium zinc oxide ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results