IGMTLSV03A is a synchronous ULVT periphery high-density ternary content addressable memory (TCAM). It is developed with TSMC 16nm 0.8V/1.8V CMOS LOGIC FinFET Compact process. Different combinations ..

It is developed with TSMC 6nm 0.75V/1.8V CMOS LOGIC FinFET Process. Different ... It is developed with TSMC 7nm ...

Taiwan Semiconductor is among the most impressive firms, with ~50% operating margins in 2024, generating ~$27B in free cash ...

Nvidia CEO Jensen Huang officially announced the Spectrum-X and Quantum-X silicon photonic (SiPh) network switches, enabling ...

Huawei Technologies is strengthening its independence in personal computing, accelerating chip development to reduce reliance ...

For Richard Lee, watching almost 8,000 miles away, it was a call to action.Most Read from BloombergThe Dark Prophet of Car-Clogged CitiesWashington, DC, Region TSMC recently announced it’s going ...

Connecting decision makers to a dynamic network of information, people and ideas, Bloomberg quickly and accurately delivers business and financial information, news and insight around the world ...

After hours: 20 March at 19:59:52 GMT-4 Loading Chart for TSM ...