Accelerating multi-die, multi-chip SoC designs The Cadence® 112Gbps Extra Short Reach (XSR) SerDes IP for TSMC 7nm consists of eight lanes operating at 112Gigabit per second using PAM4 modulation.

Thus, the impact on TSMC revenue is expected to be minor, as over 70% of its revenue comes from advanced technologies, 7nm-class production nodes, and below. Meanwhile, demand for 16nm FinFET ...

In contrast, TSMC appears to be going the multi-patterning route ... For one thing, scaling today’s 16nm/14nm finFET to 10nm and 7nm is difficult. In finFETs, there are four parts that require ...

TSMC is continuing to back the 7nm FinFET (Fin Field Effect Transistor) process for 5nm - essentially a "3D" non-planar transistor that resembles a fin. Hence the name. However, despite the fact ...

TSMC started mass production of cutting edge 7nm process two years ago ... Previously it was rumoured that the firm may abandon the FinFET transistor process at the 3nm node and will instead ...

based distributor that sells AMD products as a channel partner, said he's sure AMD's customers are asking about supply, especially because of how other companies rely on TSMC for other 7nm products.

Apple's new C1 modem is the most power-efficient baseband chip inside of an iPhone according to the company, with the new in-house 5G modem seeing a combination of TSMC 4nm and 7nm process nodes.

IGMTLSV03A is a synchronous ULVT periphery high-density ternary content addressable memory (TCAM). It is developed with TSMC 16nm 0.8V/1.8V CMOS LOGIC FinFET Compact process. Different combinations ..