Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced the successful launch of the industry's first Universal ...

This milestone was achieved using TSMC’s advanced N3P process and CoWoS® packaging ... several dies with North-South and East-West IP orientations are interconnected through CoWoS interposer. The ...

The silicon interposer that connects the dies of the two chips bridges ... Because of the similarities in core counts between generations, the improvements in Apple's architecture and TSMC's ...

prompting the firm to contract the majority of TSMC’s Chip on Wafer on Substrate (CoWoS) with silicon interposer capacity. TSMC’s Taiwan-listed shares recovered some losses after the report.

TSMC Partnership: The collaboration with TSMC in Arizona ... which is RDL organic RDL rather than silicon interposer products. So that’s a first ramp of that device, which is really exciting for us.

The Synopsys USR/XSR PHY IP for 112Gbps per lane die-to-die connectivity enables high-bandwidth ultra and extra short reach interfaces in multi-chip modules (MCMs) for hyperscale data center, ... The ...

If TSMC expands globally, Taiwan’s “silicon shield” could be diminished, leading to less global attention to Taiwan’s security. To navigate these challenges, Taiwan must safeguard its technological ...

The investment announcement also doubles Apple’s U.S. manufacturing fund, which includes silicon chip production at TSMC in Arizona. Apple says it is TSMC’s largest customer and currently ...